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Model Number: Electronic Assembly-1
Brand Name: BAM
Key Specifications/Special Features:
Ideal for PCB/PCBAHigh-precision e-testing include: ICT in line, function test,full experienced QC and QA engineerMaterial: rigid and flexible PCBBoard thicknesses: 0.6 to 3mmSurface: gold plating and immersion goldLayers: 2 to 16
Blind and buried
High TG and frequency
Lead-free
Twist and warp: less than 1%
Placement precision: 0.1mm on integrated circuit parts with SO,SOP, SOJ, TSSOP, QFP and BGA
SMT: 0201, 0402, 0603, 0805, 1008, 1206 and 1210
Dip pitches through hole down to 0.60mm
Solder components to underside of board without disrupting thetopside
Inspection in line for QOI and ICT testing in line
X-ray inspection for BGA
Maximum panel size: 550 x 660mm
Minimum hole diameter: 0.35mm
Minimum line width and space: 0.1mm
Compliant with RoHS Directive
Shipping Information:
- FOB Port: China (Mainland)
- Lead Time: 3 - 115 days
Main Export Markets:
- Eastern Europe
- North America
- Mid East/Africa
- Central/South America
- Asia
- Western Europe
- Australasia
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